The function of metal of Fu of diamond surface plating studies

Summary: After undertaking to surface of making synthetic diamond Ti of saline bath plating and chemical plating Ni, Cu is handled, the exterior form appearance of the diamond after using SEM observation plating reachs film interface, test the compressive strength of the diamond after analysing plating and heatproof corrode ability. The result makes clear, the combinative interface of the film of Ti of saline bath plating and diamond is more more compact than chemical film; Rise apparently via the diamond compressive strength after chemical plating, the diamond of plating Ti and plating Ni is heatproof corrode ability is better. Graph material of 1 foreword diamond has a collection of illustrative plates of diffraction of ray of X of the diamond after metal of 1 plating Fu tall hardness, high compressive strength, tall wearability and exceedingly good thermal conductivity and insulating property, apply extensively already at the tool, grind a domain (if diamond curiums piece, the) such as wheelhead of diamond emery wheel, diamond. Diamond tool, grind a treatment that uses the pattern that sets the bond such as grain of making synthetic diamond and metal, pottery and porcelain, colophony together to realize pair of workpiece normally, but as a result of diamond and major metal, pottery and porcelain even colophony all has taller interface can, make the adhesion of diamond and matrix poorer, cause diamond easily inchoate fall off. According to statistic, in the use process of diamond tool, only the diamond of about 10% produced cutting effect truly. Accordingly, the combinative strength that improves diamond and matrix is the crucial factor that raises diamond tool to machine efficiency and service life. Use the interface that in diamond surface plating the method of a metal reduces diamond and matrix domestic and internationally commonly at present can, the chemical metallurgy that forms stability through this metal and bond is united in wedlock () of bond of metallic bond, pottery and porcelain. Use more plating Fu metal to include the carbide such as Ti, Cr, V, W to form the blame carbide such as element and Ni, Cu, Ni-P to form an element at present. Sort of adoption plating Fu method is more also, if vacuum is small,evaporate plating can be in a variety of metals of Fu of diamond surface plating and alloy, but need special device, cost is higher; Metallic bag ooze also can be in diamond surface is effective the metal such as plating Fu Ti, Ta, Cr, Mo, W, this method also needs vacuum facility; Saline bath plating and chemical plating are two kinds of simpler plating cross a method, do not need special vacuum facility. Saline bath plating but plating Fu major carbide forms an element; And chemical plating basically is used at the blame carbide such as plating Fu Ni, Cu, Ni-P to form element and the compound film with carbide element. Country is at present right the film characteristic of diamond of Fu of plating of these two kinds of methods and its compressive strength, coverage that refuses high temperature to heat up the function such as corrode ability to research a field is not much. The article through plating of method of saline bath plating is being used in diamond surface Ti is mixed the test that uses Ni of plating of chemical plating method, Cu, the compressive strength that the analysis compared characteristic of structure of the appearance of diamond surface form that uses these two kinds of methods to obtain, film and diamond and fight ability of tall tepid corrode. 2 experiments method adds up to 45# making synthetic diamond and rod of metallic Ti pink, the mixture salt that uses NaCl and BaCl and its are enclothed to go up after a few borax and ferrosilicon pink mix, after be being built with crucible of pottery and porcelain, be in furnace of box type resistor with heat preservation of 1000 ℃ temperature 1 hour, take out of reoccupy hot water mixes salt, can get the diamond of plating Ti. Those who use alcohol and face of acetone purify diamond is smeary, with mixture acid (thick nitric acid + thick vitriolic) undertake to diamond surface thick change, after undertaking sensitize, activation and reductive processing again, put into Ni plating fluid and Cu plating fluid respectively, through can be in after proper time a Ni mixes Fu of diamond surface plating Cu. Use appearance of Y-4QX ray diffraction to be opposite the diamond of Ti of saline bath plating and chemical plating Ni, Cu undertakes X ray diffraction is analysed. The film structure after the exterior form appearance that uses electron microscope of PHILIPS XL-30FEG scanning to observe diamond of Ti of saline bath plating and chemical plating Ni, Cu and grain rupture. Check respectively not diamond of plating thin bamboo and already the exterior compressive strength of diamond of plating Fu metal (it is a group of) 40 grains. Put diamond without protective atmosphere, temperature the one calm time in the furnace of 800 ℃ , use arrive accurately 0.

The electron of 1mg analyses the weight of balance metage diamond, decide through checking the quantity burning caustic of diamond its fight high temperature to heat up corrode ability. After 3 tests result and plating of bath of analytic classics salt and chemical plating, almost the diamond of 100% all by plating clothe metal, demonstrating technology of Fu of plating of these two kinds of metals is feasible with the success. The diamond surface of Ti of saline bath plating presents grey black; The diamond surface of chemical plating Ni is shown bright argent, the diamond surface of plating Cu shows red. If a collection of illustrative plates of diffraction of ray of X of the diamond after X ray diffraction analyses the plating Fu metal that with diffraction of Y-4Q X ray appearance measures pursues 1 is shown. See by the graph, the diamond of Ti of saline bath plating appeared the diffractive peak of TiC, show Ti and diamond formed chemical metallurgy union through TiC. The diffractive peak that there are Ni and Cu on the diamond of chemical plating Ni and Cu appears; The exterior film of plating Ni diamond is the Ni that be not brilliant mostly, because Ni layer is thicker, the diffractive peak of diamond is very so weak. Appearance of film surface form analyses a scheme the exterior form appearance of Ni of the 2 plating Ti that observe to use electron microscope of PHILIPS XL-30FEG scanning, plating and plating Cu diamond. See by the graph, the diamond surface film of Ti of saline bath plating and chemical plating Ni is compact and even, and the diamond surface film of chemical plating Cu is relatively loose, and exist not plating pole place, because Cu film is thinner,this is and easy oxidation, cause film to flake, bring about film surface structure loose. (Cu of chemical plating of Ni(c) of chemical plating of Ti(b) of plating of A) salt bath pursues structural analysis graph shows the interface of film of appearance of diamond surface form after metal of 2 plating Fu 3 times the SEM image of structure of film of the surface after grain of diamond of Ni of Ti of plating of the bath that it is salt, chemical plating ruptures. See by the graph, the interface of Ti film and diamond is not apparent, interfacial office construction is compact; And the interface is very apparent between Ni film and diamond, and be ruptured to destroy because of grain of the diamond before observation, because exist between this film and diamond,come off phenomenon. Because Ti of saline bath plating is to pass diamond and Ti to produce reaction to form Tic, be in again its are outer form Ti film, the union between film and diamond is united in wedlock for metallurgy, film is accordingly compact, and the combinative strength with matrix is very high. And the principle of chemical plating is in diamond the surface forms even reductive center Pd, form film for core with Pd in plating Fu process, because this is in in chemical plating process between film and diamond,did not form metallurgy union. (Ni of chemical plating of Ti(b) of plating of A) salt bath pursues the compressive strength that the influence right watch that the influence of the plating of bath of interfacial structure salt of 3 film and diamond and chemical plating to diamond function defies intensity of pressure is spent is grain of Ti of saline bath plating and chemical plating Ni, Cu diamond. Cu of chemical plating of Ni of chemical plating of Ti of bath of the salt before plating of condition of diamond of circumstance of contrast of compressive strength of diamond of the grain that express sheet compressive strength (Kgf)65.

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3 by the watch knowable, via before the compressive strength of the diamond after Ti of saline bath plating compares plating, be being reduced somewhat; And before comparing bore with a reamer via the compressive strength of the diamond after chemical plating Ni and Cu, have bigger rise, among them the diamond compressive strength of plating Ni and plating Cu rose respectively 40% with 55% . Because the diamond when the experiment is in,the intensity of the diamond after Ti of saline bath plating reduces a likelihood is high temperature (1000 ℃ ) in processing time is too long, caused certain injury to cause to diamond. The Ceng Youcai in concerned document uses the report that compressive strength of the diamond after Ti(of saline bath plating or W) raises, but intensity increases scope very small. Because temperature of salt of the frit when saline bath plating is very high, inevitable meeting causes loss to diamond, because this uses saline bath plating,increase the compressive strength of diamond substantially hard. The face of low grade diamond that is used at chemical plating Ni and Cu is distributinging a lot of blemish and surface layer crackle, in chemical plating process, because have the exterior existence of blemish and crackle to compare flowing face more reductive centers, because this is in blemish and crackle place to be able to win deeper metallic film, this went up to have cover and effect to the blemish of diamond surface in certain level, make its compressive strength gets thereby bigger rise. The influence that defies high temperature heats up corrode ability pursues 4 for not plating metal and respectively of the diamond of plating Fu Ti, Ni, Cu fight high temperature to heat up corrode ability parallel case. By the graph 4 visible, the diamond after plating Fu metal is in high temperature (800 ℃ ) the heatproof corrode ability below is compared not aureate the diamond that belong to has relatively substantially rise, because the exterior metal layer of plating thin bamboo can is opposite below high temperature,this basically is diamond rises to protect action. The diamond of extremely different to 3 kinds of plating metal undertakes comparative, can discover: The diamond of Ti of saline bath plating is heatproof corrode ability is best, the take second place of heatproof corrode ability of diamond of chemical plating Ni, the heatproof corrode ability of diamond of chemical plating Cu is the poorest. Because metallurgy union can be formed between the film of diamond of Ti of saline bath plating and diamond,this is, can realize the effective protection of pair of diamond matrix; And the exterior film of diamond of chemical plating Cu is more loose, oxidize below high temperature serious, and there is not aureate Gang Shilou to go out in certain place, its are accordingly heatproof corrode ability is poorer. Accordingly, the diamond of plating Ti and plating Ni can be obtained better fight ability of tall tepid corrode. Graph the metals of 4 Fu of diamond surface plating that are used at making diamond tool can choose the Ti, W, Cr, carbide such as Mo to form an element, can form carbide to transfer with diamond as a result of these metals layer, the combinative strength with diamond matrix is higher, and have good heatproof corrode capacity, because this suits very,make radical of pottery and porcelain and tool of metallic radical diamond. But, to form carbide lamellae, need higher temperature, because this plating Fu shoulds not be when these tantalum,eletroplate craft, use vacuum plating or craft of plating of saline bath ooze is relatively appropriate. To the blame such as Ni, Cu carbide forms an element, can use simple chemical plating technology, but the blemish with existence film and not high strength of diamond matrix union. Among them, plating Ni can raise diamond apparently fight ability of tall tepid corrode. Bath of 4 conclusion salt can form good combinative interface between the film of plating Ti and diamond; And combinative strength is not high between the film of chemical plating and diamond. Have via the diamond compressive strength of metal of chemical plating Fu very big rise; But the compressive strength of diamond of Ti of saline bath plating does not have clear improvement. Of Ti of saline bath plating and diamond of chemical plating Ni fight diamond of Cu of plating of chemistry of excel of ability of tall tepid corrode. CNC Milling